Semiconductor inspection apparatus and tray for inspection parts used thereof

ABSTRACT

A tray of parts for inspection has a simple structure having only a tray holder that has a plurality of groove sections that store a plurality of parts for inspection on the surface, and contact sections, comprised in each groove, which have the conductor to electrically connect the electrodes of the stored parts for inspection in each groove section extends to the back surface. Under conditions where the plurality of parts for inspection are stored in the tray of parts for inspection, such tray is held by the tray holder, and the plurality of probe needles are placed on the plurality of contact sections equipped by the tray of parts for inspection all at once. Through this, electrical examination of a plurality of parts for inspection can be simultaneously performed.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a semiconductor inspection apparatusand a tray for inspection parts used thereof. In particular, suchinvention is suitable for use for an apparatus that performs electricalinspection through the placement of probe needles on semiconductor partsas targets of inspection.

2. Description of Related Art

Conventionally, electrical inspections of semiconductor chips (ICs) havebeen performed through placing the probe needles of a tester on theelectrodes of an IC for inspection. Specifically, the IC for inspectionis picked up by vacuum contact using a vacuum nozzle, and is transportedto an examining table. The probe needles are then placed on theelectrodes of the IC for inspection on such examining table and theelectrical properties are measured. When one electrical inspection of anIC is finished, the next IC for inspection is transported to theexamining table via the vacuum nozzle, and the electrical propertiesthereof are measured.

As stated above, conventionally, the ICs for inspection are transportedto the examining table one-by-one and examination of electricalproperties is performed. However, this method is problematic in that itrequires an extremely long period of time when there exist many ICs forinspection. So as to shorten the inspection time when there exists aplurality of ICs for inspection, it is desirable that a plurality of ICscan be inspected simultaneously. Conventionally, an apparatus thatenables a plurality of semiconductor elements to be simultaneouslyinspected has been proposed, for example, Japanese Patent Laid-Open No.2000-258493.

SUMMARY OF THE INVENTION

The inspection apparatus described in JP 2000-258493 is composed of trayboards that have a plurality of grooves into which a plurality ofsemiconductor chips are inserted, contactor boards that have a pluralityof probes, suppress boards that are in contact with the electrodes ofsemiconductor chips and probes, and wiring boards that fix each board.The electrodes of semiconductor chips that are inserted into the trayboards are electrically connected with external sockets via the probeson the contactor boards, electrode wiring from the probes to theconnecting pad, the connecting pin on the wiring board that is connectedwith connecting pad and solid wiring that is formed in athree-dimensional manner inside the wiring boards from the connectingpin to the external socket. Problems have occurred in that the structureof such inspection apparatus is complicated and in that highmanufacturing costs are required.

The purpose of this invention is to solve such problems, and to allowfor the simultaneous inspection of a plurality of parts for inspectionthrough using a simply structured tray of parts for inspection.

In order to solve the problems mentioned above, a semiconductorinspection apparatus of the present invention comprises a tray holderthat holds a tray for inspection parts, the tray is equipped with aplurality of grooves that store a plurality of parts for inspection onthe surface and contact sections comprised in each groove, the contactsections have the conductor used to electrically connect the electrodesof the parts for inspection stored in the each groove extends to theback surface of the tray; a probe with a plurality of needles that comeinto contact with the plurality of contact sections that extend to theback surface of the tray for inspection parts held by the tray holderall at once; and a controller that controls movements of the probe sothat the needles of the probe will come into contact with the contactsections.

In another aspect of the invention, the tray holder holds the tray forinspection parts so that the surface of the tray for inspection partsfaces upward; and the needles of the probe are formed so as to come intocontact with the contact sections of the back surface of the tray forinspection parts from the lower portion of the tray for inspection partsheld by the tray holder.

In another aspect of the invention, the tray holder holds the tray forinspection parts so that the surface of the tray for inspection partsfaces downward; and he needles of the probe are formed to come intocontact with the contact sections of the back surface of the tray forinspection parts from the upper portion of the tray for inspection partsheld by the tray holder.

Additionally, the tray for inspection parts of the invention comprises aplurality of grooves that store a plurality of parts for inspection onthe surface; and contact sections comprised in each groove, the contactsections have the conductor that electrically connects the electrodes ofthe parts for inspection stored in the each groove extends to the backsurface.

In another aspect of the invention, a side wall of the each groove has aslope, the area of the bottom surface is formed to so be smaller that ofan open end of the each groove, longitudinal and transversal dimensionsof the open end of each the groove are slightly larger than those of theparts for inspection, and longitudinal and transversal dimensions of thebottom surface of the each groove are almost equivalent to those of thepart for inspection.

In another aspect of the invention, the tray for inspection partsfurther comprises a press member that presses and fixes the parts forinspection so that the parts for inspection stored in each groove willnot move.

According to the present invention structured as described above, undera condition where the plurality of parts for inspection are stored inthe plurality of grooves equipped by the tray for inspection parts, thetray is held in the tray holder, and the plurality of probe needles areplaced on the plurality of contact sections equipped by the tray forinspection parts all at once. And electrical inspection of suchplurality of parts for inspection can be simultaneously performed.Through this, inspection time can be shortened. Also, the tray forinspection parts is remarkably simply structured so that only theplurality of grooves and the contact sections that connect from thebottom surface of the grooves to the back surface of the tray forinspection parts are formed. Thus, manufacturing costs can be lowered.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a diagram showing an example of the structure of the tray forinspection parts according to the first embodiment.

FIG. 2 is an enlarged sectional view that shows one of the groovesections formed in the tray for inspection parts according to the firstembodiment.

FIG. 3 is a diagram showing the back surface of the tray for inspectionparts.

FIG. 4 is a diagram showing an example of the structure of a substantialsection of the semiconductor inspection apparatus according to the firstembodiment.

FIG. 5 is a diagram showing an example of the structure of the tray forinspection parts according to the second embodiment.

FIG. 6 is an enlarged sectional view that shows one of the groovesections and convex sections formed in the tray for inspection partsaccording to the second embodiment.

FIG. 7 is a diagram showing an example of the structure of a substantialsection of the semiconductor inspection apparatus according to thesecond embodiment.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS First Embodiment

Hereinafter, the first embodiment of the present invention will bedescribed with reference to the drawings. FIG. 1 is a diagram that showsan example of the structure of tray for inspection parts (the tray ofparts for inspection) 10 according to the first embodiment.Additionally, FIG. 2 is an enlarged sectional view that shows one of thegroove sections 1 formed in the tray of parts for inspection 10. Also,FIG. 3 is a diagram that shows the back surface of the tray of parts forinspection 10.

As shown in FIG. 1, the tray of parts for inspection 10 of the presentembodiment has a plurality of groove sections 1 that store semiconductorchip(s) 100 as part(s) for inspection, on the surface.

As shown in FIG. 2, a side wall 1 a of the groove section 1 is formed tohave a slope to some extent, and the area of the bottom surface issmaller than that of an open end of the groove section 1. Here, thelongitudinal and transversal dimensions of the open end of the groovesection 1 are formed so as to be slightly larger than those of thesemiconductor chip 100 as the part for inspection. The longitudinal andtransversal dimensions of the bottom surface of the groove section 1 areformed in an almost equivalent manner to those of the semiconductor chip100 as the part for inspection. Due to the aforementioned structure ofthe groove section 1, it is possible for the semiconductor chip 100 tobe easily inserted into the groove section 1. At the same time, the sidewall 1 a of the boron surface section enables easy and accuratepositioning of the semiconductor chip 100.

Each groove section 1 has a contact section 2 where the conductorelectrically connecting the electrodes of the stored semiconductor chip100 extends to the back surface. The example of FIG. 2 shows a casewhere the electrodes of semiconductor chip 100 are established along theperiphery of the chip. In such case, the plurality of contact sections 2are established at a position that is appropriate given the position ofeach electrode, so as to be individually connected to the plurality ofelectrodes formed in the semiconductor chip 100. FIG. 3 shows acondition where the plurality of contact sections 2 are established at aposition that is appropriate for each electrode of the storedsemiconductor chip 100 in each groove section 1. The tray of parts forinspection 10 of the present embodiment is comprised of materials suchthat it is difficult for sections other than the contact sections 2 tobecome charged.

FIG. 4 is a diagram that shows an example of the structure of asubstantial section of the semiconductor inspection apparatus 20according to the first embodiment. As shown in FIG. 4, the semiconductorinspection apparatus 20 according to the first embodiment is structuredto include a tray holder 22 that is established on the inspection stage21, a probe 23, a transfer mechanism 24 that causes the probe 23 to betransferred, and a controller 25 that controls the movements of thetransfer mechanism 24. The transfer mechanism 24 and controller 25comprise the control section of the present invention.

The tray holder 22 holds the tray of parts for inspection 10 so that thesurface of the tray of parts for inspection 10 faces upward. Due tothis, the plurality of contact sections 2 that extend to the backsurface of the tray of parts for inspection 10 can face downward. Theprobe 23 is comprised of a plurality of probe needles 23 a that connectwith the plurality of contact sections 2 all at once equipped by thetray of parts for inspection 10 held in the tray holder 22. Such probeneedles 23 a are formed so as to come into contact with the contactsections 2 from the lower portion of the tray of parts for inspection 10held in the tray holder 22.

The transfer mechanism 24 transfers the probe 23 so that the pluralityof probe needles 23 a can come into contact with the plurality ofcontact sections 2 according to the controls of the controller 25. Suchtransfer mechanism 24 is structured to have a move board 24 a, probesupporting section 24 b, a first guide rail 24 c, and a second guiderail 24 d.

The move board 24 a is structured to be movable in a horizontaldirection (X direction) along the first guide rail 24 c, and can beactivated by an electric motor for the X-axis that is not illustrated.The probe supporting section 24 b is established on such move board 24a. The probe supporting section 24 b supports the probe 23 at the lowerpart. The probe supporting section 24 b moves in the X-direction alongwith the movement of the move board 24 a. Due to this, the probe 23moves in the X-direction along with the movement of the probe supportingsection 24 b.

Additionally, the probe supporting section 24 b is structured so as tobe movable in a vertical direction (Y-direction) to the paper space andto be movable in an up-and-down direction (Z-direction) along the secondguide rail 24 d. It can be activated by an electric motor for the Y-axisand an electric motor for the Z-axis that are not illustrated. Due tothis, the probe 23 moves in the Y-direction and Z-direction accompanyingthe movement of the probe supporting section 24 b.

Based on the tray of parts for inspection 10 and the semiconductorinspection apparatus 20 according to the first embodiment structured asabove, under a condition where the plurality of semiconductor chips 100are stored in the plurality of groove sections 1 equipped by the tray ofparts for inspection 10, the tray of parts for inspection 10 is held inthe tray holder 22, and the plurality of probe needles 23 a are placedon the plurality of contact sections 2 equipped by the tray of parts forinspection 10 all at once. Through this, electrical examination of theplurality of semiconductor chips 100 can be simultaneously preformed andexamination time can be shortened.

Also, the tray of parts for inspection 10 is remarkably simplystructured so that the plurality of groove sections 1 and the linearcontact sections 2 that connect from the bottom surface of the groovesection 1 to the back surface of the tray of parts for inspection 10.Thus, manufacturing costs can be also lowered. Furthermore, while thetray of parts for inspection 10 of the present embodiment is simplystructured, it is easy to perform the positioning through insertion ofthe semiconductor chips 100.

Second Embodiment

Next, the second embodiment of the present invention will be describedbased upon drawings. FIG. 5 is a diagram that shows an example of thestructure of the tray of parts for inspection 30 according to the secondembodiment. FIG. 6 is an enlarged sectional view that shows one of thegroove sections 1 disposed in the tray of parts for inspection 30.

As shown in FIG. 5, the tray of parts for inspection 30 of the presentembodiment is composed of the tray member 31 that has a plurality ofgroove sections 1 storing the semiconductor chips 100 as the parts forinspection on the surface, and the press member 32 that presses andfixes each such semiconductor chip 100 so that each semiconductor chip100 that is stored in the groove section 1 will remain immobile.

The tray member 31 is the same as the tray of parts for inspection 10,explained in the first embodiment. The press member 32, as shown in FIG.6, is comprised of convex sections 3 that press the semiconductor chip100 that is stored in the groove section 1 on the bottom surface of suchgroove section 1, at an opposed position of each groove section 1. Thelongitudinal and transversal dimensions of the press member 32 arealmost equivalent to those of the inner periphery surface of theexterior wall 4 of the tray member 31. Due to this, when thesemiconductor chip 100 is pressed, the press member 32 fits perfectlyinside the exterior wall 4 of the tray member 31, which will not easilycome off to the extent of being turned upside down.

FIG. 7 is a diagram that shows an example of the structure of asubstantial section of the semiconductor inspection apparatus 40according to the second embodiment. As shown in FIG. 7, thesemiconductor inspection apparatus 40 of the second embodiment is alsocomposed of the tray holder 22 that is established on the inspectionstage 21, the probe 23, the transfer mechanism 24 that transfers theprobe 23, and the controller 25 that controls the movement of thetransfer mechanism 24, in the same manner as with the semiconductorinspection apparatus 20 according to the first embodiment.

The difference between the semiconductor inspection apparatus 40according to the second embodiment and the semiconductor inspectionapparatus 20 according to the first embodiment is the supporting methodof the trays of parts for inspection 10 and 30 through the tray holder22, and the supporting structure of the probe 23 by the probe supportingsection 24 b. That it to say, according to the second embodiment, thetray holder 22 holds the tray of parts for inspection 30 so that thesurface of the tray of parts for inspection 30 faces downward. Due tothis, a plurality of contact sections 2 formed up to the back surface ofthe tray of parts for inspection 30 face upward. Also, the probesupporting section 24 b supports the probe 23 based on a pattern where aplurality of probe needles 23 a come into contact with the contactsections 2 from the upper portion of the tray of parts for inspection 30equipped by the tray holder 22.

According to the tray of parts for inspection 30 and the semiconductorinspection apparatus 40 of the second embodiment, which are structuredas above, the tray of parts for inspection 30 is held in the tray holder22 under a condition where the plurality of semiconductor chips 100 arestored in the plurality of groove sections 1 equipped by the tray ofparts for inspection 30, and the plurality of probe needles 23 a areplaced on the plurality of contact sections 2 equipped by the tray ofparts for inspection 30 all at once. Due to this, the electricalexamination of the plurality of semiconductor chips 100 can besimultaneously performed, and examination time can be shortened.

Moreover, the tray member 31 of the tray of parts for inspection 30 issimply structured to form the plurality of groove sections 1 and thelinear contact sections 2 that are connected to the back surface of thetray member 31 from the bottom surface of the groove section 1. It issufficient simply for the press member 32 to include convex section 3and electrical wiring is not especially required at all. Thus, themanufacturing cost can be also lowered.

Furthermore, according to the tray of parts for inspection 30 of thepresent embodiment, although it is simply structured, it is easy toperform positioning through insertion of the semiconductor chips 100.Moreover, through using the press member 32, press force can be operatedbetween the electrodes of semiconductor chips 100 and the contactsections 2. Due to this, the electrodes of semiconductor chips 100 andthe contact sections 2 may be placed in secure contact and goodelectrical conducting may be obtained.

Note that, the embodiments explained above have shown only one exampleof the possible incarnations upon implementing the present invention.This should not cause the technical scope of the present invention to berestrictively interpreted. That is to say, the present invention can beimplemented in various forms, without deviating from the spirit or themain characteristics thereof.

INDUSTRIAL APPLICABILITY

This present invention is useful for an apparatus that performselectrical examination through placing probe needles on semiconductorparts as the targets of examination.

1. A semiconductor inspection apparatus comprising: a tray holder thatholds a tray for inspection parts, said tray is equipped with aplurality of grooves that store a plurality of parts for inspection onthe surface and contact sections comprised in each groove, said contactsections have the conductor used to electrically connect the electrodesof said parts for inspection stored in said each groove extends to theback surface of said tray; a probe with a plurality of needles that comeinto contact with said plurality of contact sections that extend to theback surface of said tray for inspection parts held by said tray holderall at once; and a controller that controls movements of said probe sothat the needles of said probe will come into contact with said contactsections.
 2. The semiconductor inspection apparatus according to claim1; wherein said tray holder holds said tray for inspection parts so thatthe surface of said tray for inspection parts faces upward; and theneedles of said probe are formed so as to come into contact with saidcontact sections of the back surface of said tray for inspection partsfrom the lower portion of said tray for inspection parts held by saidtray holder.
 3. The semiconductor inspection apparatus according toclaim 1; wherein said tray holder holds said tray for inspection partsso that the surface of said tray for inspection parts faces downward;and the needles of said probe are formed to come into contact with saidcontact sections of the back surface of said tray for inspection partsfrom the upper portion of said tray for inspection parts held by saidtray holder.
 4. A tray for inspection parts comprising: a plurality ofgrooves that store a plurality of parts for inspection on the surface;and contact sections comprised in each groove, said contact sectionshave the conductor that electrically connects the electrodes of saidparts for inspection stored in said each groove extends to the backsurface.
 5. The tray for inspection parts according to claim 4, whereina side wall of said each groove has a slope, the area of the bottomsurface is formed to so be smaller that of an open end of said eachgroove, longitudinal and transversal dimensions of the open end of eachsaid groove are slightly larger than those of said parts for inspection,and longitudinal and transversal dimensions of the bottom surface ofsaid each groove are almost equivalent to those of said part forinspection.
 6. The tray for inspection parts according to claim 4further comprising: a press member that presses and fixes said parts forinspection so that said parts for inspection stored in said each groovewill not move.